The paper analyzes the phenomenon of heat transfer and its inertia in solids. The influence of this effect on the operation of an integrated circuit is described. The phenomenon is explained using thermal analogy implemented in the Spice environment by an R-C thermal model. Results from the model are verified by some measurements with a chip designed in CMOS 0.7 μm (5 V) technology. The microcontroller-based measurement system structure and experiment results are described.
This paper presents a study on the effect of cleaning factors on the energy consumption of the cleaning process in a CIP system, and the correlation between single components of electricity necessary to perform this process and the cleanliness degree obtained. Studies were carried out in a laboratory cleaning station, wherein a plate heat exchanger contaminated with hot milk was included. The research program was developed according to a 5-level statistical plan. Based on the results, obtained with Experiment Planner 1.0, a regression function of energy requirement considering variables such as: cleaning time, temperature and flow rate of the cleaning liquid via the cleaned exchanger has been developed. Describing this relationship, linear and quadratic functions with double interactions were used. Significance level for the analysis was established at α = 0.05. Correlation analysis between components of the electricity necessary to perform the cleaning process (pump drive and heating of the cleaning agent) and the resulting degree of cleaning of heat exchanger plates was performed.