This paper is a case study conducted to present an approach to the process of designing new products using virtual prototyping. During the first stage of research a digital geometric model of the vehicle was created. Secondly it underwent a series of tests utilising the multibody system method in order to determine the forces and displacements in selected construction nodes of the vehicle during its movement on an uneven surface. In consequence the most dangerous case of loads was identified. The obtained results were used to conduct detailed strength testing of the bicycle frame and changes its geometry. For the purposes of this case study two FEA software environments (Inventor and SolidWorks) were used. It has been confirmed that using method allows to implement the process of creating a new product more effectively as well as to assess the influence of the conditions of its usage more efficiently. It was stated that using of different software environments increases the complexity of the technical process of production preparation but at the same time increases the certainty of prototype testing. The presented example of simulation calculations made for the bicycle can be considered as a useful method for calculating other prototypes with high complexity of construction due to its systematized character of chosen conditions and testing procedure. It allows to verify the correctness of construction, functionality and perform many analyses, which can contribute to the elimination of possible errors as early as at the construction stage.
The techniques of micro and nano structurization of surfaces of various materials are utilized in electronics and medicine. Such procedure as wet and dry etching allows to fabricate protruded or recessed micro and nanostructures on the surface. In the paper some examples of utilization of a surface structurization, known from literature, are described. Some structurization methods and experimental results for fabrication of the arrays of sharp microtips are presented. Wet and/or dry etching, and thermal oxidation process were used to form the arrays of sharp gated and non-gated, protruded or recessed silicon microtips on silicon wafer. For the first time, the arrays of silicon carbide (SiC) microtips on glass wafer have been produced by use of the transfer mold technique. Arrays of sharp microtips are used as field electron emission cathodes for vacuum microelectronics devices. Some electron emission measurements for these cathodes have been carried out. New application of silicon microtips array in biochemistry has been tested with satisfactory results.