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Abstract

High heat flux removal are important issue in many perspective applications such as computer chips, laser diode arrays, or boilers working on supercritical parameters. Electronic microchips constructed nowadays are model example of high heat flux removal, where the cooling system have to maintain the temperature below 358 K and take heat flux up to 300 W/cm2. One of the most efficient methods of microchips cooling turns out to be the spray cooling method. Review of installations has been accomplished for removal at high heat flux with liquid sprays. In the article are shown high flux removal characteristic and dependences, boiling critical parameters, as also the numerical method of spray cooling analysis.
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