In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method. The solder joints were subjected to different cycle numbers up to 5000 thermal shock tests with two different thermal profiles of –30/+110°C and –40/+125°C. Microstructural properties of the tested joints were examined with the focus on intermetallic layer thickness and crack formation/propagation. Thickness of the scallop shaped Cu6Sn5 intermetallic layer was increased with increasing cycle number for both THRS and multiwave joints, but the thickening was more effective for the THRS joints. Cracks typically formed at the solder alloy/ PTH barrel and the solder alloy/pin interfaces and propagated along grain boundaries and precipitations of intermetallic compound.
In this study, silicon carbide (SiC) reinforced lead-free solder (SAC305) was prepared by the powder metallurgy method. In this method SAC305 powder and SiC powder were milled, compressed and sintered to prepare composite solder. The composite solders were characterized by optical and scanning electron microscopy for the microstructural investigation and mechanical test. Addition of 1.5 wt. % and 2 wt. % ceramic reinforcement to the composite increased compressive strengths and microhardness up to 38% and 68% compared to those of the monolithic sample. In addition, the ceramic particles caused an up to 55% decrease in the wetting angle between the substrate and the composite solder and porosity was always increased with increase of SiC particles.